OVERALL LENGTH | 38.50 MILLIMETERS MINIMUM AND |
| 39.30 MILLIMETERS MAXIMUM |
MOUNTING METHOD | UNTHREADED HOLE |
INTERNAL JUNCTION CONFIGURATION | NPN |
TRANSFER RATIO | 300.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER AND |
| 2.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-3 |
MOUNTING FACILITY QUANTITY | 2 |
OVERALL DIAMETER | 25.00 MILLIMETERS MINIMUM AND |
OVERALL HEIGHT | 19.32 MILLIMETERS MINIMUM AND |
| 22.02 MILLIMETERS MAXIMUM |
OVERALL WIDTH | 25.00 MILLIMETERS MINIMUM AND |
| 26.00 MILLIMETERS MAXIMUM |
| 26.00 MILLIMETERS MAXIMUM |
SEMICONDUCTOR MATERIAL | SILICON |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 400.0 NOMINAL REACH THROUGH VOLTAGE |
CURRENT RATING PER CHARACTERISTIC | 15.00 AMPERES NOMINAL FORWARD CURRENT, AVERAGE |
POWER RATING PER CHARACTERISTIC | 175.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
INCLOSURE MATERIAL | METAL |
TERMINAL TYPE AND QUANTITY | 2 PIN |